Erate Networking Bid Proposal
Project Information
- Bid Title
- Erate Networking Bid Proposal
- Issuing Agency
- Delta Schoolcraft Intermediate School District
- Location
- Michigan
- Published Date
- Feb 21, 2026
- Closing Date
- Feb 27, 2026
- Government Level
- State & Local
- Status
- Closed
- Original Source
- Join to Access Full Details
- Bid Inquiries
- Join to Access Full Details
- Bid Documents
- Join to Access Full Details
- Project Description
-
•••
- Attachment Preview
-
DSISD Consortium2525 3rd Ave SEscanaba, MI 49829Request for ProposalsNetwork ElectronicsRequest For Proposal Year: 2026/2027FY2026 E-Rate FORM 470 – 260022325School District Contact:Beau Boden, IT DirectorTechnology DepartmentPhone: 906.786.9300E-mail: bboden@dsisd.netPrepared by:Triple R ConsultantsP.O. Box 302South Lyon, MI 48178Phone: 810.923.9290E-mail: bob@triple-r.usDSISD ConsortiumContentsREQUEST FOR PROPOSALS – NETWORK ELECTRONICS ..................................................................................... 31.0.0 INVITATION TO BID........................................................................................................................................32.0.0 BIDDER INSTRUCTIONS................................................................................................................................. 33.0.0 GENERAL CONDITIONS ................................................................................................................................. 54.0.0 UNIVERSAL SERVICE FUND (USF) CONDITIONS ..................................................................................... 85.0.0 SCOPE OF WORK ............................................................................................................................................. 96.0.0 TIMELINE REQUIREMENTS......................................................................................................................... 107.0.0 AWARDED CONTRACT REQUIREMENTS................................................................................................. 11PRODUCTS AND SERVICES SPECIFICATIONS....................................................................................................... 178.0.0 NETWORK ELECTRONICS SPECIFICATIONS........................................................................................... 179.0.0 SYSTEM DOCUMENTATION ....................................................................................................................... 20APPENDIX A – INTENT TO BID FORM ..................................................................................................................... 21APPENDIX B – BID SIGNATURE PAGE .................................................................................................................... 22APPENDIX C – BILL OF MATERIALS TOTALS ....................................................................................................... 23APPENDIX D - FAMILIAL DISCLOSURE AFFIDAVIT ............................................................................................ 24APPENDIX E - IRAN LINKED BUSINESS AFFIDAVIT............................................................................................ 25APPENDIX F – PREVAILING WAGE.......................................................................................................................... 26FY2026-NetworkElectronics RFP-2600223252/20/2026ii©2008 Confidential Proprietary intellectual property; use of this property is limited to RFP responses only.Any other use of this property requires expressed written permission by Triple R Consultants.DSISD ConsortiumREQUEST FOR PROPOSALS – NETWORK ELECTRONICS1.0.01.1.01.2.01.3.01.4.02.0.02.1.0INVITATION TO BIDBID ACCEPTANCEDSISD Consortium, hereby known as “District”, will accept sealed responses (“Bids”) to this Request for Proposals(RFP) for Network Electronics projects which comply with the Invitation to Bid, Bidder Instructions, GeneralConditions, Universal Service Fund (USF) Conditions, Scope of Work, Timeline Requirements, Awarded ContractRequirements, and Products and Services Specifications set forth below and submitted to the District at the followingaddress:DSISD ConsortiumNetwork Electronics - FY2026 USF BidAdministration Building – Attention: Beau Boden2525 3rd Ave SEscanaba, MI 49829INTENT TO BID FORMAll Bidders must complete and submit the Intent to Bid Form, Appendix A, no later thanFebruary 27, 2026. The Bidder shall be responsible for the timely delivery of the Intent to Bid Form. The Biddershall make no additional stipulations on the Intent to Bid Form or qualify their Bid in any other manner.FACILITIES/BUILDING WALKTHROUGHThere are no walkthroughs scheduled for this RFP.ADDENDUM QUESTIONSAll Bidders must complete and submit all major addendum questions by February 27, 2026.BIDDER INSTRUCTIONSBID OPENINGAll Bid responses to this RFP must be in duplicate in a sealed opaque envelope labeled as follows:Network Electronics - FY2026 USF Bid and “March 20, 2026”. The bidder must also upload a complete electroniccopy of their bid on the Triple R bidder portal no later than 2:00 PM, March 20, 2026. The bidder must contactJeremy Flores at jeremy@triple-r.us to request access into the bidder portal for bid submission.2.1.1 No oral, telephonic, telegraphic, e-mail or facsimile Bids will be considered.2.1.2 No Bids will be considered after 2:00 PM, March 20, 2026.2.1.3The Bidder shall be responsible for the timely delivery of the Bid; the District shall not be liable to any Bidderfor any delivery or postal delays and postmarking to the bid opening date will not substitute for receipt of theBid.2.1.4All timely submitted Bids received by the District will be opened at the Administration Building, 2525 3rdAve S, Escanaba, MI 49829 at 2:00 PM, March 20, 2026 for recommendation to the Board of Educationat a future regularly scheduled meeting.2.1.5If the District is closed due to unforeseen circumstances on the bid opening date, Bids will still be openedusing the bidder portal for all properly submitted bids uploaded to the bidder portal by 2:00 PM, March20, 2026. The district must receive the paper copy from the bidder within three days of the bid openingdate or the bid is subject to rejection.FY2026-NetworkElectronics RFP-2600223252/20/20263©2008 Confidential Proprietary intellectual property; use of this property is limited to RFP responses only.Any other use of this property requires expressed written permission by Triple R Consultants.DSISD Consortium2.2.02.3.0BID BONDSThe Bidder shall submit a five percent (5 %) Bid Bond, of the total base Bid price, made payable to DSISDConsortium, with the sealed Bid. No Bid Bond is required if the total base Bid price is less than thirty-onethousand three-hundred and twenty-one dollars ($31,321.00). Any Bids for $31,321.00 or more received withouta Bid Bond will be rejected by the District.CLARIFICATIONS AND CORRECTIONSDirect any and all questions regarding this RFP by email to: Beau Boden at: bboden@dsisd.net. The resultinganswers, along with the questions shall be posted on USAC website.2.4.02.5.0GENERAL REQUIREMENTS2.4.1 The District or its representatives shall not be held responsible for expenses incurred in the preparation orsubsequent presentation of the Bid response.2.4.2 This RFP for Network Electronics is not an offer to enter into a contract, but rather a solicitation for Bids.2.4.3 The Bidder shall supply, upon request, samples and/or brochures of the proposed materials and equipmentwith the Bid.2.4.4 There are no drawings associated with this RFP.2.4.5The District reserves the right to reject Bids submitted without a five percent (5%) Bid Bond, signed BidSignature Page, Bill of Materials, Familial Disclosure Affidavit, Iran Linked Business Affidavit, and a list offour (4) references.BID IDENTIFICATION REQUIREMENTSThe Bid shall include the full legal name of the Bidder, its business address, telephone number, and a statementidentifying the Bidder as a sole proprietorship, partnership, corporation, or other legal entity. A proprietorship shallstate the full name of the proprietor, a partnership shall state the full names of the general partners, and a corporationshall identify the state in which it is incorporated. Each copy of the Bid shall be signed by the person or personslegally authorized to bind the Bidder to a contract.2.5.1 The Bidder shall complete and submit, along with the Bid, a Bid Signature Page, Appendix B, in long hand,in ink, by an authorized representative.2.5.2 The Bidder shall complete and submit, along with the Bid, a Bill of Materials, Appendix C, summarizing thedetails of the Bid.2.5.3The submitted Bid shall include a Familial Disclosure Affidavit form, Appendix D, which is properlycompleted, signed by an authorized representative of the Bidder and notarized with an affixed, raised notaryseal.2.5.4The submitted Bid shall include an Iran Linked Business Affidavit form, Appendix E, which is properlycompleted, signed by an authorized representative of the Bidder and notarized with an affixed, raised notaryseal.2.5.5 The submitted Bid shall include a list of at least four (4) references, one (1) of which must be a school orschool district, for similar work performed within the past three (3) years.FY2026-NetworkElectronics RFP-2600223252/20/20264©2008 Confidential Proprietary intellectual property; use of this property is limited to RFP responses only.Any other use of this property requires expressed written permission by Triple R Consultants.DSISD Consortium2.6.0DEFINITIONSThe foregoing definitions are made available for the purpose of this Request for Proposals (RFP) only.2.6.1 District – DSISD Consortium2.6.2 Bidder(s) – Business Entities and/or Person(s) submitting the Bid.2.6.3 Bid(s) – A complete and properly executed proposal to perform the Scope of Work, or designated portionthereof, for the sums stated within the Bid.2.6.4 Base Bid – The sum stated in the Bid for which the Bidder offers to perform the Scope of Work whereinwork may be added or subtracted for sums stated in the Alternate Bid, if any.2.6.5 Alternate Bid – An amount stated in the Bid to be added or subtracted from the amount of the Base Bid, ifsaid change in the Scope of Work, method of construction and/or materials is accepted by the District.2.6.6 Selected Vendor/Contractor – The Bidder(s) receiving formal notice of acceptance of his/her Bid(s) andhas been duly served by an officer or agent of the District duly authorized to give such notice.3.0.03.1.03.2.03.3.03.4.03.5.0GENERAL CONDITIONSRIGHTS OF ACCEPTANCE OR REJECTIONThe District’s Board of Education reserves the right to reject any and all Bids in whole, or in part, and accept any Bidor portion of the Bid that, in their opinion, best serves the interests of the District.QUALIFICATION OF BIDDERSFor the purpose of assuring the District of the quality of workmanship, materials, products and/or services, the Boardof Education will retain the right and has complete discretion to qualify or disqualify any Bidders on the basis ofavailable information concerning the Bidder’s ability to perform as needed and the suitability of the products and/orservices included in the Bid as described in sections 3.4.0 and 3.5.0. Each Bidder, by submitting a Bid, representsthat:3.2.1 The Bidder has read and understands all the Bid requirements, conditions and specifications contained herein.3.2.2 The Bidder has the option to visit the District work site and familiarize themselves with the local conditionsunder which the work is to be performed.3.2.3 The Bid is based upon the materials, systems and equipment described, without exception, in all Biddocuments supplied by the District.VARIANCE AND PRICEAny variance from the specifications in section 8.0.0 of this RFP must be fully explained in writing by the Bidder.All prices quoted in the Bid must be on a unit price basis and include the total price. The price of an item or unit of agiven product as promised in a Bid cannot be changed by the service provider regardless of whether the Districtchanges the quantity of the item or unit needed.MANUFACTURER(S) BRANDS/MODEL NUMBERSThe naming of a manufacturer(s), brand or model number will not be considered as excluding other brands or modelnumbers for purposes of later providing the products as promised in the Bid. Specifically, similar products withcomparable construction, material and workmanship will be considered as equal. Notwithstanding, the Board ofEducation of the District has complete discretion to evaluate the merits of all Bids submitted and can take intoconsideration the brand and/or model numbers set forth in the Bids.MANUFACTURER(S) SUBSTITUTIONSAny substitution from the specified products and/or services by the manufacturer(s) is acceptable if at no additionalcost to the District and approved by an authorized district representative prior to placing the order for said productsand/or services. The District reserves the right to refuse any and all manufacturer(s) substituted products and/orservices.FY2026-NetworkElectronics RFP-2600223252/20/20265©2008 Confidential Proprietary intellectual property; use of this property is limited to RFP responses only.Any other use of this property requires expressed written permission by Triple R Consultants.
- Commodity Codes
-
- NAICS 541512Computer Systems Design Services
- NAICS 541519Other Computer Related Services
* Disclaimer: Government BidHub provides information on bids, RFPs (Requests for Proposals), and RFQs (Requests for Qualifications) solely for convenience and informational purposes. This site is not an official public notice board. For official details, responses, or inquiries, please contact the relevant government agency directly.
Empower Your Bidding Strategy
Unlock Government BidHub's unparalleled access to high-quality, tailored bid information.
- Access an extensive database of bids, including comprehensive local and state opportunities.
- Receive customized alerts for the bids that matter most to your business.
- Explore detailed specifications to ensure precise and competitive submissions.
- Gain a competitive edge with up-to-date information and exclusive opportunities.
See Also
Release Date Project with Bid Documentation Mandatory Pre-Bid Site Visit Bid Due Date
Oakland University
Bid Due: 7/08/2026
FORM 5550 #10 FF WINDOW COLLE...
Description: FORM 5550 #10 FF WINDOW COLLECTIONS ENVELOPE Department: Technology, Management and Budget
State of Michigan
Bid Due: 7/17/2026