UP-Microchip Packaging Cleanroom Renovation
Project Information
- Bid Title
- UP-Microchip Packaging Cleanroom Renovation
- Issuing Agency
- Pennsylvania State University
- Location
- Pennsylvania
- Published Date
- Dec 11, 2024
- Closing Date
- Jan 9, 2025
- Government Level
- State & Local
- Status
- Closed
- Ref. #
- 00-08958.00
- Original Source
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- Bid Documents
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- Project Description
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Project Number00-08958.00Project StatusTrade/Bid PackagesComplete - Architect/Engineer and Design/Build SelectionComplete - Construction Manager Selection and Other ServicesCampusUniversity ParkProject StageRFPProject Description
Construction of the new micro electronic systems packaging research laboratory.
The Semiconductor Research Corporation (SRC)’s Joint University Microelectronics Program 2.0 (JUMP 2.0) has announced the creation of a new Penn State-led Center for Heterogeneous Integration of Micro Electronic Systems (CHIMES).
The Semiconductor Research Corporation (SRC)’s Joint University Microelectronics Program 2.0 (JUMP 2.0) has announced the creation of a new Penn State-led Center for Heterogeneous Integration of Micro Electronic Systems (CHIMES). The focus of this research is to collaborate to advance the effective integration and packaging of semiconduction devices, chips, and other components. Two new advanced research facilities are required to support the EE Department’s new research goals. The purpose of this project is to complete the design of the new micro-electronic systems packaging research laboratory and determine the anticipated construction cost.
Architect/ Engineer and Design Build SelectionPenn State Project Leader Name, EmailConstruction Manager Selection and Other ServicesCapital Project (>$10M)YesProject Stage for Architect/Engineer and Design/Build SelectionAppointment CompleteProfessional ConsultantDate of Appointment SelectionOct 19, 2023Company NameStantec Architecture and Engineering LLCContact NameGeorge RiekePhone(412) 394-7042EmailGeorge.Rieke@stantec.comAttachments for Architect/Engineering and Design/Build SelectionTrade/Bid Package InformationProject Stage for Construction Manager Selection and Other ServicesAwardedCM FirmAttachments for Construction Manager Selection and Other ServicesCompany NameAlexander Building Construction Co.Contact NameDennis WalterPhone(814) 931-0780Emaildennis.walter@butz.comProject Stage for Trade/Bid Package InformationRFPPrequalificationContact Dennis Walter (dennis.walter@butz.com) and Tina Petrie (tina.petrie@butz.com) for Prequalification Criteria.
Additional InformationContact Dennis Walter (dennis.walter@butz.com) and Tina Petrie (tina.petrie@butz.com) for RFP Documents.
All submissions shall be submitted electronically (.pdf) to Dennis Walter (dennis.walter@butz.com) , Dave Sillner (David.sillner@butz.com) , Scott Erney (Scott.Erney@butz.com) , Julie Patrick (jat280@psu.edu) , Jesse Wells (jgw124@psu.edu) , and Todd Webber (tdw16@psu.edu) .
Bid Due Date and Time01/09/2025 - 03:00 pm
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