Montana Microfabrication Facility Chip Bonding Tool
Project Information
- Bid Title
- Montana Microfabrication Facility Chip Bonding Tool
- Issuing Agency
- State Government of Montana
- Location
- Montana
- Published Date
- Jan 5, 2026
- Closing Date
- Jan 16, 2026
- Government Level
- State & Local
- Status
- Closed
- Ref. #
- MSU-IFB-2026-0784
- Original Source
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- Bid Inquiries
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- Bid Documents
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- Project Description
-
Montana Microfabrication Facility Chip Bonding Tool
The Montana Microfabrication Facility is purchasing a tool for chip bonding to assemble and package photonic integrated circuits (PICs) and related devices.
Open: 1/5/2026 9:00 AM MST
Close: 1/16/2026 2:00 PM MST
Type: IFB
Number: MSU-IFB-2026-0784
Contact:
Mary Hardin mary.hardin1@montana.edu
Contact:
Heather Modroo Heather.Modroo@montana.edu
Details:View as PDF
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