Multichip Module Package for SiC Pressure Sensors

Project Information

Bid Title
Multichip Module Package for SiC Pressure Sensors
Issuing Agency
NATIONAL AERONAUTICS AND SPACE ADMINISTRATION
Location
Ohio
Published Date
Jun 27, 2026
Closing Date
Jun 30, 2026
Government Level
Federal
Status
Closed
Ref. #
80NSSC26936730Q
Original Source
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Bid Inquiries
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Bid Documents
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Project Description
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Multichip Module Package for SiC Pressure Sensors
Active
Contract Opportunity
Notice ID
80NSSC26936730Q
Related Notice
Department/Ind. Agency
NATIONAL AERONAUTICS AND SPACE ADMINISTRATION
Sub-tier
NATIONAL AERONAUTICS AND SPACE ADMINISTRATION
Office
NASA SHARED SERVICES CENTER
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General Information
  • Contract Opportunity Type: Combined Synopsis/Solicitation (Original)
  • Original Published Date: Jun 26, 2026 06:04 am CDT
  • Original Date Offers Due: Jun 30, 2026 07:00 am CDT
  • Inactive Policy: 15 days after date offers due
  • Original Inactive Date: Jul 15, 2026
  • Initiative:
    • None
Classification
  • Original Set Aside:
  • Product Service Code: 6695 - COMBINATION AND MISCELLANEOUS INSTRUMENTS
  • NAICS Code:
    • 334419 - Other Electronic Component Manufacturing
  • Place of Performance:
    Cleveland , OH 44135
    USA
Description

** THIS IS A SOLE SOURCE REQUIREMENT ** for Multichip Module Package for SiC Pressure Sensors


Attachments/Links
Contact Information
Contracting Office Address
  • JERRY HLASS ROAD, BLDG. 1111
  • STENNIS SPACE CENTER , MS 39529
  • USA
Primary Point of Contact
Secondary Point of Contact


History
  • Jun 26, 2026 06:04 am CDTCombined Synopsis/Solicitation (Original)
Commodity Codes
  • FSC 66Instruments and Laboratory Equipment
  • NAICS 334419Other Electronic Component Manufacturing
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