ENGINEERED WOOD CHIPS
Project Information
- Bid Title
- ENGINEERED WOOD CHIPS
- Issuing Agency
- City of Springfield
- Location
- Missouri
- Published Date
- Jul 1, 2026
- Closing Date
- Jul 22, 2026
- Original Source
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- Bid Inquiries
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- Bid Documents
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- Commodity Codes
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- Project Description
- Bid Number: 005-2027IFIB Bid Title: ENGINEERED WOOD CHIPS Category: All Notifications – Division of Purchases Status: Open Description: LEGAL NOTICE:…... To view the bid detail, please sign up here.
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See Also
Leaf and Wood Chip Hauling Se...
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Drexel Technologies
Bid Due: 7/08/2026