AMERICAN SEMICONDUCTOR, INC
Website: Company Website
Address: 6987 W Targee St, Boise, Idaho, 83709-3209
Phone: 208-336-2773 x14
Fax: 208-336-2752
Contact Person: LORELLI HACKLER
Legal Structure: Corporation
Year Established: 2001
Sales/Service Area: Australia; Austria; Finland; Germany; Italy; Netherlands
Principals: 1. Douglas R Hackler Sr, CEO 2. Lorelli D Hackler, CFO
Products & Services
American Semiconductor serves the semiconductor and related industries as the leading developer and manufacturer of ultra-thin chip technology and manufacturing. The company invented and supplies Semiconductor-on-Polymer (SoP) wafer level chip scale packaging (WLCSP) for thin device applications that include, but are not limited to, chip-on-flex, protected fan-in, heterogeneous integration and multi-chip packaging. The company provides design, assembly, test and custom engineering services for thin-device technology. As an advanced packaging and assembly provider, American Semiconductor enables reliable high efficiency advanced packaging, assembly and test of thin electronics. Headquartered in Boise, Idaho, American Semiconductor operates a 9,000 square foot facility housing WLCSP fabrication, assembly and test operations.
semiconductor, american semiconductor, custom processing, mixed signal, wafer fabrication, substrate materials, mid-rom, foundry, wafer fabrication, wafer processing, process, simulation, sbir/sttr, rf, ldmos, cmos, nmos, bicmos, mosfet, gaas, silicon, compound semiconductor, hbt, trench, metal-gate, custom, power, american
a pure-play wafer fabrication foundry offering cmos, mixed signal, mid-rom and nmos standard processes. custom processing is available for research, start-ups and proof of concept for silicon and alternative substrate materials.
Keywords
- Flexible Computer Chips
- Flexible Hybrid Electronics
- Flex
- Fhe
- Thin Semiconductors
- Advanced Packaging
NAICS Code(s)
- 334412: Bare Printed Circuit Board Manufacturing
- 334413: Semiconductor and Related Device Manufacturing
- 541330: Engineering Services
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